Diamond wire quality inspection

Views: 0     Author: Site Editor     Publish Time: 2022-04-06      Origin: Site

Electroplated diamond wire is a linear cutting tool made of electroplated metal as a bonding agent and solidified diamond abrasive on the core wire through electrodeposition. It is widely used in solar silicon wafers, LEDs, semiconductors, gems, optical glass, etc. The cutting of precious materials and precision devices has significant advantages such as high cutting efficiency, high precision, environmental protection, and energy-saving. The manufacturing technology of diamond wire products is becoming more and more mature. Many documents have researched and introduced the manufacturing process of diamond wire, but the detection technology is relatively backward. At present, the quality inspection of diamond wire products can only rely on a micrometer to detect the outer diameter. With the aid of a solid microscope, the plating layer of the wire saw and the distribution of electroplated diamond abrasive grains can not be quantitatively inspected and analyzed.

Here is the content list:

  • Quantitative analysis method of diamond wire surface morphology.

  • Diamond wire analysis results.

  • Terminology and physical meaning of testing diamond wire.

Quantitative analysis method of diamond wire surface morphology

Based on microscopic image analysis, using mathematical three-dimensional modeling method, the diamond wire surface abrasive grain height, abrasive grain rate, abrasive grain area ratio, wire saw wire diameter, wire saw envelope wire diameter, abrasive grain accumulation size, And other parameters were quantitatively analyzed. This method uses advanced computer image processing technology to automatically analyze the collected diamond wire image information, which is efficient, fast, and convenient.

Diamond wire analysis results

Through microscopic image analysis of diamond wire products on the market, we can know:

(1) Diamond wire abrasive grain height, rate of abrasive grain dispersion, coating compactness are important factors affecting the cutting efficiency and durability of diamond wire saws. The surface brightness deviation of diamond wire is small, and the abrasive grains are visible, indicating that the diamond wire coating is dense and the abrasive grains are firmly bonded. Otherwise, the diamond wire coating is loose and the abrasive grains are not firmly bonded, which will seriously reduce the cutting efficiency and durability of the diamond wire.

(2) For the electroplated diamond wire of 70/80μm, the height of the abrasive grains should be controlled within 6.0-8.5μm; the effective rate of abrasive grains should be determined according to the specific parameters of the customer's cutting machine; the abrasive grains should not have large accumulations, Abrasive particles accumulate to form nickel nodules, which will produce line marks or scratches during the diamond wire cutting process; the virtual high or virtual plated abrasive particles on the diamond wire surface should be minimized, which may cause the TTV to increase.

(3) For the diamond wire of 70/80μm, the use results show that the deviation of the diamond wire outer diameter (envelope wire warp) should be controlled within ±3μm.

Terminology and physical meaning of testing diamond wire

Wire saw bare wire: refers to the wire saw base metal wire before the diamond wire is electroplated, referred to as bare wire.

Bare wire diameter: refers to the diameter of the wire saw base metal wire before the diamond wire is electroplated.

Wire saw wire diameter: The diamond wire does not contain abrasive grains and is coated with metal wire diameter.

Envelope wire diameter: refers to the diameter of the highest abrasive grain that the diamond wire envelops.

Blade height: refers to the distance from the highest point of diamond wire abrasive grains to the wire diameter surface of the wire saw.

Cutting edge rate: refers to the sum of the number of grinding grains on the circumference of the diamond wire per millimeter in length, and the unit is piece/mm.

Abrasive grain area ratio: in a unit length, it refers to the ratio of the surface area of the wire diameter covered by the diamond wire abrasive grains to the wire diameter surface area in the same length.

Accumulation diameter: the equal circle diameter of the area covered by the abrasive grains on the surface of the diamond wire. This index reflects the dispersion of abrasive particles on the surface of the wire saw.

At last

The quality of our company's diamond wire is up to standard. After so many years of market testing, it is trustworthy. If you need it, please contact us through our company's official website.


JIANGXI XINGUANG DIAMOND TOOLS CO., LTD.
Add: Industrial Park, tianfanjie Town, Poyang County, Jiangxi Province
FOLLOW US
Copyright 2020 Jiangxi Xinguang Diamond Tools Co., Ltd. All Rights Reserved