Views: 0 Author: Site Editor Publish Time: 2022-05-04 Origin: Site
It is a future trend for diamond cutting the wire to replace traditional cutting lines in the semiconductor and silicon wafer cutting industries. Through a comparative analysis of electroplated diamond cutting wire and resin bond diamond cutting wire, the advantages and disadvantages of each are pointed out; electroplated diamond cutting wire has high strength and combined strength Strong, good heat and wear resistance, but long production cycle and high cost; resin bond diamond cutting wire has a short production cycle and low cost, which is more suitable for the field of silicon wafer cutting, but it has low bonding force and poor heat and wears resistance. The cutting volume is small.
Here is the content list:
Research on resin bond diamond cutting wire.
The manufacturing process of diamond cutting wire.
Diamond cutting wire has many advantages.
The resin bond diamond cutting wire uses the resin bond as an intermediate bridge to consolidate diamond abrasive grains on the surface of the core wire to form a consolidated diamond cutting wire. The manufacturing method is that the resin containing diamond abrasive grains is coated on the surface of the core wire, and cured by heating or ultraviolet light irradiation. According to different types of resin bond, resin bond diamond cutting wire can be divided into thermosetting resin bond diamond cutting wire and ultraviolet light curing resin bond diamond cutting wire. The manufacturing method of thermosetting resin bond diamond cutting wire usually uses thermosetting phenolic resin to consolidate abrasive grains on the surface of the core wire by heating. Ultraviolet curing resin bond diamond cutting wire is based on the rapid curing mechanism of ultraviolet light resin, which quickly consolidates diamond abrasive grains on the surface of the core wire. Due to the problems of resin bond diamond cutting wire with low abrasive grain holding power, poor heat resistance, poor wear resistance, etc., the current main research direction focuses on how to improve the holding force of resin and abrasive grains, and the resistance of resin bond diamond cutting wire. In terms of abrasiveness and heat resistance, the ultimate goal is to improve the service life of the resin bond diamond cutting wire.
In terms of the manufacturing process, heat-curing resin bond diamond cutting wire usually requires high-temperature heating for a long time, resulting in low production efficiency and high energy consumption. However, in the application field, the thermosetting resin bond diamond cutting wire has the characteristics of large holding force on diamond abrasive grains, good resin wears resistance and heat resistance, etc., which have been partially used in the industrial cutting field and have achieved good results.
Production process: brass-plated steel wire → surface activation cleaning → configuration of diamond blend material → coated steel wire → primary curing → secondary curing → finished product.
1. High-speed cutting can be achieved, and the cutting speed can be increased to twice the original, and the time consumption is naturally reduced.
It can complete more work per unit time, which is the biggest advantage of diamond cutting wire.
2. Environmentally-friendly production. Only water or water-based cooling and cleaning fluid are needed in the cutting process of diamond cutting wire, which truly realizes environmentally-friendly production and manufacturing.
At last
Our company has invested a lot of research funds in the production process of diamond cutting wire. You can trust it. If you need it, please contact us.
